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document number: mpc17510 rev. 3.0, 8/2006 freescale semiconductor advance information * this document contains certain information on a new product. specifications and information herein are subject to change without notice. ? freescale semiconductor, in c., 2006. all rights reserved. 1.2 a 15 v h-bridge motor driver ic the 17510 is a monolithic h-bridge designed to be used in portable electronic applications such as digital and slr cameras to control small dc motors. the 17510 can operate efficiently with supply voltages as low as 2.0 v to as high as 15 v. its low r ds(on) h-bridge output mosfets (0.45 ? typical) can provide continuous motor drive currents of 1.2 a and handle peak currents up to 3.8 a. it is easily interfaced to low- cost mcus via parallel 5.0 v compatible logic. the device can be pulse width modulated (pwm-ed) at up to 200 khz. this device contains an integrat ed charge pump and level shifter (for gate drive voltages), integrated shoot-through current protection (cross-conduction suppression logic and timing), and undervoltage detection and shutdown circuitry. the 17510 has four operating modes: forward, reverse, brake, and tri-stated (high impedance). features ?2.0 v to 15 v continuous operation ? output current 1.2 a (dc), 3.8 a (peak) ? 450 m ? r ds(on) h-bridge mosfets ?5.0 v ttl- / cmos-compatible inputs ? pwm frequencies up to 200 khz ? undervoltage shutdown ? cross-conduction suppression ? pb-free packaging designated by suffix code ej figure 1. 17510 simplified application diagram h-bridge motor driver mtb suffix ej suffix (pb-free) 98ash70455a 24-lead tssop 17510 ordering information device temperature range (t a ) package MPC17510EJ/r2 -30c to 65c 24 tssopw mpc17510mtb mpc17510mtbel vdd cres c1l c1h c2l c2h in2 in1 en out2 out1 gout vm gnd mcu gin motor 5.0 v 15 v 17510
analog integrated circuit device data 2 freescale semiconductor 17510 internal block diagram internal block diagram figure 2. 17510 simplifi ed internal block diagram 3 23 2 21 8 1 5 17 18 6 19 4 7 20 22 15 charge pump h-bridge level shifter predriver control logic low voltage detector tout vm1 vm2 outa outa' outb' outb pgnd1 pgnd2 nc cres vdd lgnd 24 tinb 16 en 10 in2 9 in1 12 c1l 11 c1h 13 c2l 14 c2h
analog integrated circuit device data freescale semiconductor 3 17510 pin connections pin connections figure 3. 17510 pin connections table 1. 17510 pin definitions a functional description of each pin can be found in the functional pin description section beginning on page 8 . pin number pin name formal name definition 1, 5 out1 output 1 driver output 1 pins. 2 lgnd logic ground logic ground. 3 cres charge pump output capacitor connection charge pump reservoir capacitor pin. 4, 7, 20, 22 nc no connect no connection to these pins. 17, 18 out2 output 2 driver output 2 pins. 6, 19 pgnd power ground power ground. 8, 21 vm motor drive power supply motor power supply voltage input pins. 9 in1 input control 1 control signal input 1 pin. 10 in2 input control 2 control signal input 2 pin. 11 c1h charge pump 1h charge pump bucket capacit or 1 (positive pole). 12 c1l charge pump 1l charge pump bucket capacitor 1 (negative pole). 13 c2l charge pump 2l charge pump bucket capacitor 2 (negative pole). 14 c2h charge pump 2h charge pump bucket capacit or 2 (positive pole). 15 gout gate driver output output gate driver signal to external mosfet switch. 16 en enable control enable control signal input pin. 23 vdd logic supply control circuit power supply pin. 24 gin gate driver input low = true control signal for gout pin. gin nc pgnd out2 out2 en gout c2h c2l v dd nc vm out1 out1 pgnd nc vm in1 in2 c1l lgnd c res nc c1h 24 20 19 18 17 16 15 13 23 22 21 14 5 6 7 8 9 10 11 12 2 3 4 1
analog integrated circuit device data 4 freescale semiconductor 17510 electrical characteristics maximum ratings electrical characteristics maximum ratings table 2. maximum ratings all voltages are with respect to ground unless otherwise no ted. exceeding these ratings may cause a malfunction or permanent damage to the device. ratings symbol value unit motor supply voltage v m - 0.5 ? - 16 v charge pump output voltage (1) vcres -0.5 to 13 v logic supply voltage v dd -0.5 to 16 v signal input voltage (en, in1, in2, gin ) v in -0.5 to v dd + 0.5 v driver output current continuous peak (2) i o i opk 1.2 3.8 a esd voltage (3) human body model machine model v esd1 v esd2 1900 130 v storage temperature t stg -65 to 150 c operating junction temperature t j -30 to 150 c operating ambient temperature t a -30 to 65 c power dissipation (4) p d 1.0 w thermal resistance r ja 120 c/w soldering temperature (5) t solder 260 c notes 1. when supplied externally, connect via 3.0 k ? resistor. 2. t a = 25 c, 10 ms pulse at 200 ms interval. 3. esd1 testing is performed in accor dance with the human body model (c zap = 100 pf, r zap = 1500 ? ), esd2 testing is performed in accordance with the machine model (c zap = 200 pf, r zap = 0 ? ). 4. t a = 25 c, r ja = 120 c/w, 37 mm x 50 mm cu area (1.6 mm fr-4 pcb). 5. soldering temperature limit is for 10 seconds maximum duration. not designed for imme rsion soldering. exc eeding these limits may cause malfunction or permanent damage to the device.
analog integrated circuit device data freescale semiconductor 5 17510 electrical characteristics static electrical characteristics static electrical characteristics table 3. static electric al characteristics characteristics noted under conditions t a = 25 c, v m = 15 v, v dd = 5.0 v, gnd = 0 v unless otherwise noted. typical values noted reflect the approximate parameter means at t a = 25c under nominal conditions unless otherwise noted. characteristic symbol min typ max unit power motor supply voltage v m 2.0 ? 15 v logic supply voltage v dd 4.0 ? 5.5 v capacitor for charge pump c1, c2, c3 0.001 ? 0.1 f standby power supply current (6) motor supply standby current logic supply standby current i vmstby i vddstby ? ? ? 0.3 1.0 1.0 a ma logic supply current (7) i vdd ? 3.3 4.0 ma low-voltage detection circuit detection voltage (v dd ) (8) detection voltage (v m ) v dd det v m det 1.5 4.0 2.5 5.0 3.5 6.0 v driver output on resistance (9) v m = 2.0 v, 8.0 v, 15 v r ds(on) ? 0.45 0.55 w gate drive gate drive voltage (10) no current load v cres 12 13 13.5 v gate drive ability (internally supplied) i cres = -1.0 ma v cresload 10 11.2 ? v gate drive output i out = -50 a i in = 50 a v gouthigh v goutlow v cres - 0.5 lgnd v cres - 0.1 lgnd + 0.1 v cres lgnd +0.5 v control logic logic input voltage (en, in1, in2, gin ) v in 0 ? v dd v logic input function (4.0 v < v dd < 5.5 v) high-level input voltage low-level input voltage high-level input current low-level input current en / gin pin v ih v il i ih i il i il v dd x 0.7 ? ? -1.0 - 200 ? ? ? ? - 50 ? v dd x 0.3 1.0 ? ? v v a a a notes 6. excluding pull-up resistor current, including current of gate-drive circuit. 7. f in = 100 khz. 8. detection voltage is defined as when t he output becomes high-impedance after v dd drops below the detection threshold. when the gate voltage v cres is applied from an external source, v cres = 7.5 v. 9. i o = 1.2 a source + sink. 10. input logic signal not present.
analog integrated circuit device data 6 freescale semiconductor 17510 electrical characteristics dynamic electrical characteristics dynamic electrical characteristics table 4. dynamic electri cal characteristics characteristics noted under conditions t a = 25 c, v m = 15 v, v dd = 5.0 v, gnd = 0 v unless otherwise noted. typical values noted reflect the approximate parameter means at t a = 25c under nominal conditions unless otherwise noted. characteristic symbol min typ max unit input (en, in1, in2, gin ) pulse input frequency f in ? ? 200 khz input pulse rise time (11) t r ? ? 1.0 (12) s input pulse fall time (13) t f ? ? 1.0 (12) s output propagation delay time turn-on time turn-on time turn-off time t pzh t plh t phl ? ? ? 0.3 1.2 0.5 1.0 2.0 1.0 s gout output delay time (14) turn-on time turn-off time t ton t toff ? ? ? ? 10 10 s charge pump circuit oscillator frequency rise time (15) f osc t v creson 100 ? 200 0.1 400 1.0 khz ms low-voltage detection time t vdd det ? ? 10 ms notes 11. time is defined between 10% and 90%. 12. that is, the input waveform slope must be steeper than this. 13. time is defined between 90% and 10%. 14. load is 500 pf. 15. time to charge c res to 11 v after application of v dd .
analog integrated circuit device data freescale semiconductor 7 17510 electrical characteristics timing diagrams timing diagrams figure 4. t plh , t phl , and t pzh timing figure 5. low-voltage detection timing t pzh * , 10% in1, in2, en outn 50% 90% t phl t plh * the last state is ?z?. (gin ) (gout) ( t ton) ( t toff) t vdddet 0% v dd i m 3.5 v 90% t v dd det v dd deton v dd detoff (<1.0 a ) 50% 1.5 v table 5. truth table input output en in1 in2 gin out1 out2 gout h l l x z z x h h l x h l x h l h x l h x h h h x l l x l x x x l l l h x x l x x h h x x h x x l h = high. l = low. z = high impedance. x = don?t care. the gin pin and en pin are pulled up to v dd with internal resistance.
analog integrated circuit device data 8 freescale semiconductor 17510 functional description introduction functional description introduction the 17510 is a monolithic h-bridge power ic applicable to small dc motors used in portable electronics. the 17510 can operate efficiently with supply voltages as low as 2.0 v to as high as 15 v, and it can provide continuos motor drive currents of 1.2 a while handling peak currents up to 3.8 a. it is easily interfaced to low- cost mcus via parallel 5.0 v- compatible logic. the device can be pulse width modulated (pwm-ed) at up to 200 khz. the 17510 has four operating modes: forward, reverse, br ake, and tri-stated (high impedance). basic protection and operati onal features (direction, dynamic braking, pwm control of speed and torque, main power supply undervoltage detection and shutdown, logic power supply undervoltage detection and shutdown), in addition to the 1.0 a rms output current capability, make the 17510 a very attractive, cost-effective solution for controlling a broad range of small dc motors. in addition, a pair of 17510 devices can be used to control bipolar stepper motors. the 17510 can also be used to excite transformer primary windings with a switched square wave to produce secondary winding ac currents. as shown in figure 2, 17510 simplified internal block diagram , page 2 , the 17510 is a monolithic h-bridge with built-in charge pump circuitry. for a dc motor to run, the input conditions need to be set as follows: enable input logic high, one input logic low, and the other input logic high (to define output polarity). the 17510 can execute dynamic braking by setting both in1 and in2 logic high, causing both low-side mosfets in the output h-bridge to turn on. dynamic braking can also implemented by taking the enable logic low. the output of the h-bridge can be set to an open- circuit high-impedance (z) condition by taking both in1 and in2 logic low. (refer to table 5, truth table , page 7 ). the 17510 outputs are capable of providing a continuous dc load current of up to 1.2 a. an internal charge pump supports pwm frequencies to 200 khz. the en pin also controls the charge pump, turni ng it off when en = low, thus allowing the 17510 to be placed in a power-conserving sleep mode. functional pin description output 1 and output2 (out1, out2) the out1 and out2 pins provide the connection to the internal power mosfet h-bridge of the ic. a typical load connected between these pins would be a small dc motor. these outputs will connect to ei ther vm or pgnd, depending on the states of the control inputs (refer to table 5, truth table , page 7 ). power ground and logic ground (pgnd, lgnd) the power and logic ground pins (pgnd and lgnd) should be connected together with a very low-impedance connection. charge pump reservo ir capacitor (cres) the cres pin provides the connection for the external reservoir capacitor (output of th e charge pump). alternatively this pin can also be used as an input to supply gate-drive voltage from an external source via a series current-limiting resistor. the voltage at the cres pin will be approximately three times the v dd voltage, as the internal charge pump utilizes a voltage tripler circuit. the v cres voltage is used by the ic to supply gate drive for the internal power mosfet h-bridge. motor supply voltage input (vm) the vm pins carry the main supply voltage and current into the power sections of the ic . this supply then becomes controlled and/or modulated by th e ic as it delivers the power to the load attached between out1 and out2. all vm pins must be connected together on the printed circuit board with as short as possible traces offering as low impedance as possible between pins. vm has an undervoltage threshold. if the supply voltage drops below the undervoltage threshold, the output power stage switches to a tri-state condition. when the supply voltage returns to a level that is above the threshold, the power stage automatically resumes normal operation according to the established condition of the input pins. control signal input and enable control signal input (in1, in2, en) the in1, in2, and en pins are input control pins used to control the outputs. these pins are 5.0 v cmos-compatible inputs with hysteresis. the in1, in2, and en work together to control out1 and out2 (refer to table 5, truth table ). gate driver input (gin) the gin input controls the gout pin. when gin is set logic low, gout supplies a level-shifted high-side gate drive signal to an external mosfet. when gin is set logic high, gout is set to gnd potential.
analog integrated circuit device data freescale semiconductor 9 17510 functional description functional pin description charge pump bucket capacitor (c1l, c1h, c2l, c2h) these two pairs of pins, the c1l and c1h and the c2l and c2h, connect to the external bucket capacitors required by the internal charge pump. the typical value for the bucket capacitors is 0.1 f. gate driver output (gout) the gout output pin provides a level-shifted, high-side gate drive signal to an external mosfet with c iss up to 500 pf. control circuit power supply (vdd) the vdd pin carries the 5.0 v supply voltage and current into the logic sections of the ic. vdd has an undervoltage threshold. if the supply volt age drops below the undervoltage threshold, the output power st age switches to a tri-state condition. when the supply voltage returns to a level that is above the threshold, the power stage automatically resumes normal operation according to the established condition of the input pins.
analog integrated circuit device data 10 freescale semiconductor 17510 typical applications functional pin description typical applications figure 6 shows a typical application for the 17510. figure 6. 17510 typical application diagram cemf snubbing techniques care must be taken to protect the ic from potentially damaging cemf spikes induced when commutating currents in inductive loads. typical practice is to provide snubbing of voltage transients by placing a capacitor or zener at the supply pin (vm) (see figure 7 ). figure 7. cemf snubbing techniques mcu 17510 5.0 v gnd c1l c1h c2l c2h cres en gin in1 in2 vm v dd motor gout solenoid out1 out2 17510 5.0 v 15 v c1l c1h c2l c2h c res vm v dd out1 out2 gnd 17510 5.0 v 15 v c1l c1h c2l c2h c res vm vdd out1 out2 gnd
analog integrated circuit device data freescale semiconductor 11 17510 packaging package dimensions packaging package dimensions for the most current package revision, visit www.freescale.com and perform a keyword search using the ?98a? listed below. mtb suffix ej suffix (pb-free) 24-pin plastic package 98ash70455a issue b
analog integrated circuit device data 12 freescale semiconductor 17510 packaging package dimensions (continued) package dimensions (continued) mtb suffix ej suffix (pb-free) 24-pin plastic package 98ash70455a issue b
analog integrated circuit device data freescale semiconductor 13 17510 revision history revision history revision date description of changes 2.0 7/2006 ? implemented a revision history page. ? converted to freescale format, and updated to the prevaiing form and style ? added ej pb-free package 3.0 8/2006 ? corrected symbol in table 3, driver output on resistancefrom ?w? to " ? "
mpc17510 rev. 3.0 8/2006 information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc., 2006. all rights reserved. how to reach us: home page: www.freescale.com e-mail: support@freescale.com usa/europe or locations not listed: freescale semiconductor technical information center, ch370 1300 n. alma school road chandler, arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) support@freescale.com japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor literature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com rohs-compliant and/or pb-free versions of freescale products have the functionality and electrical characteristics of thei r non-rohs-compliant and/or non-pb-free counterparts. for further information, see http://www.freescale.com or contact your freescale sales representative. for information on freescale?s environmental products program, go to http:// www.freescale.com/epp .

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